Cu-PHC is a high purity, low level residual phosphorus, deoxidized copper. It has a very high electrical and thermal conductivity, good welding and soldering properties as well as resistance to hydrogen. It has excellent hot and cold forming properties, and a good corrosion resistance in water and especially in atmosphere (including industrial atmosphere). Cu-PHC has a higher conductivity than Cu-HPC. The alloy is registered US EPA antimicrobial.
Cu-DLP is a phosphorus-deoxidized copper with a limited, medium amount of residual Phosphorus. It has a good electrical conductivity and excellent welding and soldering properties. It can be formed excellent, either hot or cold. The alloy is registered US EPA antimicrobial.
Cu-OFE is a high purity, oxygen free, non phosphorus-deoxidized copper that does not contain in vacuum evaporating elements. It has a very high electrical and thermal conductivity, good welding and excellent soldering properties. It has excellent hot and cold forming properties, and a good corrosion resistance, especially in atmosphere due to a good adherence of the oxide layer. Cu-OFE can be heat treated in reducing atmosphere. The alloy is registered US EPA antimicrobial.
Cu-DHP is a phosphorus-deoxidized copper with a limited, high amount of residual Phosphorus. It has excellent welding and soldering properties and is resistant against hydrogen embrittlement. It can be formed excellent, either hot or cold. The alloy is registered US EPA antimicrobial.
Cu-HCP is a high purity, low level residual phosphorus, deoxidized copper. It has a very high electrical and thermal conductivity, good welding and soldering properties as well as resistance to hydrogen. It has excellent hot and cold forming properties, and a good corrosion resistance in water and especially in atmosphere (including industrial atmosphere). The alloy is registered US EPA antimicrobial.
Cu-ETP is an oxygen containing copper which has a very high electrical and thermal conductivity. It has excellent forming properties. Due to its oxygen content soldering and welding properties are limited. The alloy is registered US EPA antimicrobial.
CuZn10 has very good cold forming properties and is well suited for e.g. coinage, beating, embossing. This alloy has a higher strength as pure copper. It has good welding and brazing properties as well as a good corrosion resistant and is not fragile to stress corrosion and dezincification. CuZn10 is principally used in jewellery, metal goods, watch industry and in electronic industry for installation parts.We produce qualities with grain sizes below 5 μm if needed. The alloy type is listed in the USA by EPA to have good antimicrobial properties.
STOL®194 is a medium strength alloy, with fine Fe precipitations. It combines high conductivity with medium strength and good relaxation properties. The alloy is listed in USA by EPA to have good antimicrobial properties.