STOL®75 is a CuCrSiTi alloy that can be hardened by cold forming and by precipitation heat treatment. It has good bendability, excellent hot and cold forming properties, a good strength and a good corrosion resistance. The relaxation properties, even at temperatures up to 250°C are excellent. The electrical and thermal conductivity is excellent. Welding, soldering and brazing properties are good too.
Cu-PHC is a high purity, low level residual phosphorus, deoxidized copper. It has a very high electrical and thermal conductivity, good welding and soldering properties as well as resistance to hydrogen. It has excellent hot and cold forming properties, and a good corrosion resistance in water and especially in atmosphere (including industrial atmosphere). Cu-PHC has a higher conductivity than Cu-HPC. The alloy is registered US EPA antimicrobial.
Cu-DLP is a phosphorus-deoxidized copper with a limited, medium amount of residual Phosphorus. It has a good electrical conductivity and excellent welding and soldering properties. It can be formed excellent, either hot or cold. The alloy is registered US EPA antimicrobial.
Cu-OFE is a high purity, oxygen free, non phosphorus-deoxidized copper that does not contain in vacuum evaporating elements. It has a very high electrical and thermal conductivity, good welding and excellent soldering properties. It has excellent hot and cold forming properties, and a good corrosion resistance, especially in atmosphere due to a good adherence of the oxide layer. Cu-OFE can be heat treated in reducing atmosphere. The alloy is registered US EPA antimicrobial.
Cu-DHP is a phosphorus-deoxidized copper with a limited, high amount of residual Phosphorus. It has excellent welding and soldering properties and is resistant against hydrogen embrittlement. It can be formed excellent, either hot or cold. The alloy is registered US EPA antimicrobial.
Cu-HCP is a high purity, low level residual phosphorus, deoxidized copper. It has a very high electrical and thermal conductivity, good welding and soldering properties as well as resistance to hydrogen. It has excellent hot and cold forming properties, and a good corrosion resistance in water and especially in atmosphere (including industrial atmosphere). The alloy is registered US EPA antimicrobial.
Cu-ETP is an oxygen containing copper which has a very high electrical and thermal conductivity. It has excellent forming properties. Due to its oxygen content soldering and welding properties are limited. The alloy is registered US EPA antimicrobial.
CuZn36 is the major brass alloy for the cold forming process. Even though brasses with lower Zinc content have better cold forming properties, CuZn36 is the most used alloy. Reasons for this are on the one hand economical due to lower price of Zinc compared to Copper, on the other hand the forming properties of this alloy meet the demand of many applications .
The alloy type is listed in the USA by EPA to have good antimicrobial properties..
CuZn37 is the major brass alloy for the cold forming process. Even though brasses with lower Zinc content have better cold forming properties, CuZn37 is the most used alloy. Reasons for this are on the one hand economical due to lower price of Zinc compared to Copper, on the other hand the forming properties of this alloy meet the demand of many applications. The alloy type is listed in the USA by EPA to have good antimicrobial properties.
CuZn33, as well as CuZn28 and CuZn30 is combining excellent cold forming properties with good mechanical strength. CuZn30 has good hot forming properties and excellent soldering and brazing properties. Due to the outstanding deep drawing properties CuZn33 and the other two mentioned alloys are called “deep-draw” or “cartridge” brass. We produce qualities with grain sizes below 5 μm if needed. The alloy type is listed in the USA by EPA to have good antimicrobial properties.